| PCB Technology and Testing Capabilities |
| Precision Manufacturing and Superior QualityFrom engineering design (DFM) to final delivery, our production and testing processes are fully digitalized for end-to-end monitoring. With advanced process technology and comprehensive testing methods, we provide solid quality assurance for your products from prototyping to mass production.For more information, please contact us at: pcb@superb-tech.comPCB Process & Testing WorkflowWe’ve organized the production process into 6 core stages based on manufacturing logic, making it easier to understand the full lifecycle of PCB production and quality control.Stage 1: Pre-Production PreparationLay the foundation for manufacturing by verifying design feasibility and defining process parameters.Process NameMain PurposeInstruments & ProcessesPre-production EngineeringReview design documents and determine process parameters1. Manual review of design documents to confirm compliance with manufacturing capabilities 2. CAM (Computer-Aided Manufacturing) software to check the integrity and accuracy of design data (e.g., line width, hole position, layer alignment)Stage 2: Inner Layer Circuit FabricationCreate precise inner-layer circuits, the core conductive layer of multi-layer PCBs.Process NameMain PurposeInstruments & ProcessesInner Layer ImagingAccurately transfer circuit patterns onto inner-layer copper-clad boardsAOI (Automated Optical Inspection) equipment: Compare with standard patterns to verify: – Integrity of circuit patterns – Accuracy of line width and line spacing – Absence of missing lines or short circuitsEtchingRemove unnecessary copper foil to form precise inner-layer circuits1. AOI equipment: Detect over-etching/under-etching and neatness of circuit edges 2. Metallographic microscope: Observe cross-sections to confirm copper layer thickness meets requirementsPhotoresist StrippingCompletely remove residual photoresist from inner-layer circuits1. Visual inspection (or with a magnifying glass) 2. Confirm no photoresist residue remains on circuit surfaces (residue may affect subsequent lamination)Inspection & Post-Etch PunchInspect inner-layer circuit quality and complete positioning holes1. AOI equipment: Recheck for circuit defects (e.g., open circuits, short circuits) 2. Hole diameter measuring instrument: Verify hole size accuracy 3. Coordinate measuring instrument: Check hole position precision (ensures alignment with other layers)Alternative Oxide CoatingForm a uniform anti-oxidation coating on copper layer surfaces1. Film thickness gauge: Measure coating thickness (ensures uniformity) 2. Surface roughness tester: Detect coating surface roughness (optimizes adhesion for lamination)Stage 3: Lamination & DrillingBond multi-layer materials and drill holes for inter-layer connection.Process NameMain PurposeInstruments & ProcessesLaminationPress multi-layer board materials together under high temperature and pressure1. X-ray inspection equipment: Detect internal air bubbles and inter-layer alignment (prevents delamination) 2. Hardness tester: Measure board hardness (ensures structural stability)DrillingDrill vias (for inter-layer conduction) and mounting holes per design requirements1. Hole diameter measuring instrument: Verify hole size accuracy 2. Hole position measuring instrument: Check hole position precision 3. Microscope: Observe hole wall quality (e.g., no burrs, no delamination)Stage 4: Outer Layer Circuit FabricationComplete outer-layer circuits and ensure electrical conduction between layers.Process NameMain PurposeInstruments & ProcessesMetallization of the DielectricDeposit a metal layer on hole walls and insulating surfaces to achieve electrical conduction1. Metallographic microscope: Observe thickness and uniformity of the hole-wall metal layer 2. Micro-ohmmeter: Measure resistance of the hole metal layer (ensures low-resistance conduction)Outer Layer ImagingAccurately transfer outer-layer circuit patterns onto the board surfaceAOI equipment: Check: – Accuracy of pattern transfer – Integrity of outer-layer circuits – Alignment with inner layersCopper PlatingUniformly plate a copper layer on the board surface and in holes1. Film thickness gauge: Measure copper plating thickness (ensures conductivity and durability) 2. Hull cell test: Evaluate plating solution performance (indirectly reflects copper plating quality)Photoresist Stripping (Outer Layer)Remove photoresist used in outer-layer circuit fabricationVisual inspection (or with a magnifying glass): Confirm no photoresist residue on outer-layer circuitsFinal EtchingPrecisely etch to form the final outer-layer circuit1. AOI equipment: Check for short circuits, open circuits, and etching quality 2. Metallographic microscope: Observe circuit cross-section size (ensures compliance with design specifications)Tin StrippingRemove the protective tin layer on circuitsVisual inspection: Confirm complete removal of the tin layer (residue may affect solder mask application)Stage 5: Surface Treatment & MarkingProtect circuits, improve solderability, and add identification marks.Process NameMain PurposeInstruments & ProcessesSolder Mask ApplicationAccurately apply a solder mask layer and expose pads1. AOI equipment: Check: – Coverage of the solder mask layer (no missing areas) – Accurate exposure of pads (prevents solder mask from covering pads) 2. Film thickness gauge: Measure solder mask thickness (ensures insulation and durability)Surface FinishImprove circuit surface solderability and anti-oxidation performance1. Film thickness gauge: Measure the thickness of the surface treatment layer (e.g., ENIG, HASL) 2. Contact angle measuring instrument: Detect surface wettability (ensures good solderability)SilkscreenPrint clear characters, logos, or part numbers1. Visual inspection: Check clarity and integrity of characters/logos 2. Magnifying glass: Verify neatness of silkscreen pattern edges (no smudging or blurring)Stage 6: Electrical Test & ShapingVerify electrical performance and cut boards into finished products.Process NameMain PurposeInstruments & ProcessesElectrical TestDetect PCB electrical performance1. Flying probe tester (for small-batch/prototype): Detect open circuits, short circuits, insulation resistance, and impedance 2. Bed-of-nails tester (for mass production): High-speed testing of electrical parameters (ensures no functional defects)Routing & V-ScoringCut boards into individual finished products or machine V-grooves (for easy separation)1. Calipers: Measure the size of cut boards (ensures compliance with design dimensions) 2. Microscope: Check cut edge quality (no burrs or damage to circuits)Why Choose Our PCB Manufacturing?Full Digital Monitoring: Every process is tracked digitally, ensuring traceability of quality data.Multi-Level Quality Checks: AOI, microscopic inspection, and electrical testing are integrated into each stage to avoid defects.Professional Equipment: Advanced instruments (e.g., X-ray inspection, flying probe testers) guarantee precision.For customized PCB solutions or technical consultations, contact us at pcb@superb-tech.com! |
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